Home » Why Swindon? » ASIC Development

ASIC Design and Development

Swindon’s team of ASIC designers, utilising our own IP library from production proven former designs and supplemented by the digital block IP libraries of its foundry partners, form the base for a predictable development plan.

In all ASICs, where market leadership is the aim, there will be a requirement for custom circuits in order to provide that competitive edge. Swindon has a depth of engineering talent that ensures that all aspects of the design can be met in-house. This ensures that the customer will still meet the critical time-to-market but also benefit from a unique solution and product.

The ASIC development phase includes:

  • Mixed signal ASIC design (analogue and digital)
  • Corner simulations and verifications
  • Custom layout
  • Synthesis of all digital sections
  • Top level integration, layout and verification
  • Design documentation
  • Final wafer probe and ATE production test programmes
  • Qualification plan
  • Design Tape Out procedure

Foundry Process

Swindon combines its own expertise with that of the world’s leading analog/mixed-signal semiconductor foundry services. By combining our market leading ASIC design and test capabilities with their specialised expertise in advanced analog and mixed signal process technologies we provide our customers with an expert and secure route to advanced product realisation.

    Foundry Process Information

    NameProcess DescriptionCore(V)I|OMV|HV(V)OPTONVM
    55/65nmFlexibile analog mixed-signal1.2|1.8|2.53.3|5|8|12eFlash
    0.13µm High flexibility analog mixed-signal1.53.3
    0.18µmHigh performance mixed signal, high temperature, high-voltage and NVM1.83.36|10|15|20|40|
    45
    TrimOTP
    eFlash
    NVRAM
    0.18µm

    High performance analog mixed signal 1.83.3 5.0TrimOTP
    PolyFuse
    0.18µmPower Management1.8
    5.0
    5.013|15|25|30|40|
    45|60
    TrimOTP
    PolyFuse
    EEPROM
    eFlash
    0.18µmImage Sensor Enabled3.31.8
    3.3
    TrimOTP
    PolyFuse
    0.25µmAnalog/digital mixed signal baseline2.53.3
    5.0
    eFlash
    0.35µmHigh performance, high voltage 3.33.3 5.012|14|18|45|55|
    75|100
    TrimOTP
    ZenerZap
    HD OTP
    NV Latch
    EEPROM
    CEEPROM
    0.35µmHigh temperature analog mixed signal3.33.3 5.012|14|18|45|55|
    75|100
    TrimOTP
    ZenerZap
    EEPROM
    CEEPROM
    0.35µmHigh speed opto3.33.3
    5.0
    12PolyFuse
    ZenerZap
    0.35µmUltra-High-Voltage5.05.020|40|700ZenerZap

    Memory Options

    Memory OptionsTypical SizeData RetentionEndurance
    SRAM64-512kbits
    Trim Registers
    Bit Writeable OTP1 - 128 bits

    10 Years @ 85˚C10k Cycles
    Bit R/W 1 - 128bits
    Word Writeable OTP8bit - 2kbit
    Application Memory
    OTP1kbit, 64kbit, 256kbit10 Years @ 85˚C1k Cycles @ 85˚C
    EEPROM32bit – 32kbit10 Years @ 125˚C100k Cycles
    CEEPROM
    (Fast access and lower power)
    32bit – 4kbit10 Years @ 125˚C100k Cycles
    FLASH32kbit – 1Mbit20 Years @ 85˚C1k Cycles @ 85˚C
    NVRAM1kbit – 16kbit10 Years @ 125˚C10k Cycles

    Custom IC Builder

     IC Builder is a new way for designers to visualise what their mixed signal ASIC and MEMS solution may look like for their application.

    Click by click,  progressively add the functions required for your intelligent sensing application and see what your resulting package could look like. 

    Coming soon. Enter your email below and we'll let you know when it is live.

    Like to discuss a project or have a question?

    Or call us now

    +44 1793 649400